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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Ball Assignments and Descriptions
Table 7: Ball/Pad Descriptions
Symbol
CA[9:0]
CK, CK#
CKE[1:0]
CS[1:0]#
DM[3:0]
DQ[31:0]
DQS[3:0],
DQS[3:0]#
V DDQ
V SSQ
V DDCA
V SSCA
V DD1
V DD2
V SS
V REFCA , V REFDQ
ZQ
DNU
NC
(NC)
Type
Input
Input
Input
Input
Input
I/O
I/O
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Reference
–
–
–
Description
Command/address inputs: Provide the command and address inputs according
to the command truth table.
Clock: CK and CK# are differential clock inputs. All CA inputs are sampled on
both rising and falling edges of CK. CS and CKE inputs are sampled at the rising
edge of CK. AC timings are referenced to clock.
Clock enable: CKE HIGH activates and CKE LOW deactivates the internal clock
signals, input buffers, and output drivers. Power-saving modes are entered and
exited via CKE transitions. CKE is considered part of the command code. CKE is
sampled at the rising edge of CK.
Chip select: CS# is considered part of the command code and is sampled at the
rising edge of CK.
Input data mask: DM is an input mask signal for write data. Although DM balls
are input-only, the DM loading is designed to match that of DQ and DQS balls.
DM[3:0] is DM for each of the four data bytes, respectively.
Data input/output: Bidirectional data bus.
Data strobe: The data strobe is bidirectional (used for read and write data) and
complementary (DQS and DQS#). It is edge-aligned output with read data and
centered input with write data. DQS[3:0]/DQS[3:0]# is DQS for each of the four
data bytes, respectively.
DQ power supply: Isolated on the die for improved noise immunity.
DQ ground: Isolated on the die for improved noise immunity.
Command/address power supply: Command/address power supply.
Command/address ground: Isolated on the die for improved noise immunity.
Core power: Supply 1.
Core power: Supply 2.
Common ground
Reference voltage: V REFCA is reference for command/address input buffers,
V REFDQ is reference for DQ input buffers.
External impedance (240 ohm): This signal is used to calibrate the device out-
put impedance for S4 devices. For S2 devices, ZQ should be tied to V DDCA .
Do not use: Must be grounded or left floating.
No connect: Not internally connected.
No connect: Balls indicated as (NC) are no connects, however, they could be con-
nected together internally.
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
38
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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